HELLER 1809 MK III Solder Reflow Oven Trusted Distributor

The HELLER 1809 MK III Solder Reflow Oven, offered by a trusted distributor, delivers superior soldering performance with precise thermal control, instant response heating, and advanced forced convection zones. Designed for high-volume PCB production, it ensures consistent solder quality, efficient cooling, and reliability in demanding SMT assembly environments.

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Conveyor System

Specification Value
Mesh Belt Conveyor Height 35.5″ + 2.0″ (90 cm + 5 cm)
Maximum PCB Width 18″ (46 cm) / 22” (56 cm) with wider module
Space Required Between PCBs 0.0″ (0.0 cm)
Conveyor Length On-Load 18″ (46 cm) * 3″ (7.5 cm)
Conveyor Length Off-Load 18″ (46 cm) * 3″ (7.5 cm)
Heated Tunnel Length 105″ (254 cm)
Process Clearance Above Mesh Belt 2.3″ (5.8 cm)
Mesh Belt Pitch 0.5″ (1.27 cm)
Maximum Conveyor Speed 74″/Min (188 cm/min)
Conveyor Direction Left to Right (Standard), Right to Left (Optional)
Conveyor Speed Control Closed Loop

Edge Hold Conveyor System

Specification Value
Height from Floor – Standard 37.0″ + 2.0″ (94 cm + 5 cm)
Height from Floor – Optional 32.6″ +3.9″ / -.4″ (83 cm +10 cm / -1 cm)
Clearance Above & Below Conveyor Pins 1.15″ (2.9 cm)
Length of PCB Support Pins 0.187″ (4.75 mm)
3 mm Long Support Pins Optional
Minimum/Maximum Board Width 2.0″–18″ (5–46 cm), up to 22” (56 cm) optional
Power Width Adjustment Standard
Computer Controlled Width Adjust Optional
Auto Lubrication System Optional

Heating System

Specification Value
Forced Convection Zones (Top & Bottom) 9
Heater Type Instant response open coil
Heater Material Nichrome
Profile Change Time 5 – 15 minutes
Temperature Control Accuracy ±0.1°C
Cross-Belt Temperature Tolerance ±2.0°C
Heater Wattage Per Zone 6000 W
Temperature Range Standard 60 – 350°C
High Temperature Option Up to 450°C

Cooling System

Specification Value
Number of Cooling Zones (Standard) 2
Additional Cooling Zones Optional
Water Cooling Optional