Meraif SMT Plant Video Showcase
Show your visitors that Meraif is not only about theory and brochures, but about real factories, real lines, and real results. This page brings together curated videos demonstrating how Meraif designs, installs, and supports SMT production lines across different industries and regions. Buyers can quickly understand what “0‑to‑1 SMT Machine Solution for Entire Factories” means in practice.
Pre-SMT Dust Removal And Deionization
Typical inline loading & line integration: PCBs are automatically transferred into the unit from upstream conveyor/unloader. Most inline cleaners support standard line handshaking (e.g., SMEMA), making it easy to synchronize with printer and pick-and-place cycle time.
Cleaning workflow commonly shown in the demo: Select board/recipe → adjust rail width → PCB enters cleaning zone → ionizing air neutralizes static electricity while the vacuum system removes loose dust/particles → a tacky roller / adhesive paper captures fine debris by contact. The cleaned PCB then exits directly toward the solder paste printer and the following pick-and-place process.
Most direct benefits for pick-and-place users:
Reduces print and placement instability caused by dust, fibers, or debris—especially for fine-pitch components and small passives.
Neutralizes static to reduce re-attraction of particles and lower ESD-related risks during transfer and handling, keeping the board surface more controllable.
Cleaning workflow commonly shown in the demo: Select board/recipe → adjust rail width → PCB enters cleaning zone → ionizing air neutralizes static electricity while the vacuum system removes loose dust/particles → a tacky roller / adhesive paper captures fine debris by contact. The cleaned PCB then exits directly toward the solder paste printer and the following pick-and-place process.
Most direct benefits for pick-and-place users:
Reduces print and placement instability caused by dust, fibers, or debris—especially for fine-pitch components and small passives.
Neutralizes static to reduce re-attraction of particles and lower ESD-related risks during transfer and handling, keeping the board surface more controllable.
SMT printer + chip mounter in an SMT line
Solder paste printing (Stencil printing) as the first quality gate A stencil printer deposits solder paste onto PCB pads using a squeegee/print stroke; this step largely determines downstream placement stability and final solder joint quality.In-line transfer & interface readiness (the “line integration” signal) For B2B buyers, the hidden story is the interface between machines: smooth handoff, fewer stops, and predictable cadence. If your line uses SMEMA, it’s a board-transfer interface specification for SMT equipment; if you’re upgrading data/traceability, Hermes is designed as a successor protocol for board transfer communication.
Comprehensive SMT Plant Solutions
Meraif is China’s leading provider of comprehensive SMT (Surface Mount Technology) plant solutions. With over 20 years of hands-on experience in SMT factory operations, we offer end-to-end support – from initial consultation and factory layout to equipment integration and training – ensuring a smooth, efficient production line. Our services cover every stage of a project: equipment selection, line design, installation, calibration, and commissioning. In other words, we handle the entire “0-to-1” SMT factory build process so you can start manufacturing as quickly and reliably as possible. We take a partnership approach to understand your needs and deliver smarter, tailored solutions. Ultimately, Meraif gives you a turnkey SMT assembly line – a complete, ready-to-run production setup including all machines, conveyors, and software – customized to your board designs, throughput requirements, and budget.
Meraif seletive wave soldering machine
This clip centers on a selective soldering workflow typically used after SMT placement + reflow, when a board still has connectors, transformers, pin headers, or other THT components that must be soldered with high repeatability.
On a selective wave soldering machine, the process generally includes:
Localized fluxing: flux is applied only where soldering is required (rather than coating the whole board).
Preheating / flux activation: raises the assembly temperature to support wetting and proper hole fill.
Mini-wave / nozzle soldering: a programmable nozzle creates a small solder wave so only targeted joints are soldered—helping avoid thermal shock or disturbing nearby SMT components.
Nitrogen option (common in selective soldering): often used to reduce oxidation/dross and improve wetting consistency.
On a selective wave soldering machine, the process generally includes:
Localized fluxing: flux is applied only where soldering is required (rather than coating the whole board).
Preheating / flux activation: raises the assembly temperature to support wetting and proper hole fill.
Mini-wave / nozzle soldering: a programmable nozzle creates a small solder wave so only targeted joints are soldered—helping avoid thermal shock or disturbing nearby SMT components.
Nitrogen option (common in selective soldering): often used to reduce oxidation/dross and improve wetting consistency.