JUTZE Mirage 3D SPI OEM Manufacturer High-Precision System

JUTZE Mirage 3D SPI OEM Manufacturer High-Precision System delivers advanced solder paste inspection with dual 2D/3D imaging, RGB+White LED lighting, and high-speed cameras. Offering accurate detection of defects like bridging, voids, or insufficient paste, it ensures reliable PCB quality control with automated handling.

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Parameter Mirage Mirage-D
Model Mirage Mirage-D
Lighting System RGB + White LED ring lighting RGB + White LED ring lighting
Vision System 3D two-direction digital projector 3D two-direction digital projector
Camera 4M / 12M industrial high-speed 4M / 12M industrial high-speed
Resolution 10µm – 15µm (adjustable) 10µm – 15µm (adjustable)
Height Resolution 1µm 1µm
Product Size W1080 × D1300 × H1850mm W1083 × D1445 × H1800mm
Weight 777 KG 950 KG
FOV Size 30.6 × 30.6mm (4M/15µm) 40.9 × 30.7mm (12M/10µm)
PCB Size 50 × 70mm – 510 × 460mm Single lane: 50 × 70mm – 510 × 590mm
Dual lanes: 50 × 70mm – 510 × 330mm
PCB Thickness 0.6mm – 6mm 0.6mm – 6mm
Warpage Compensation ±3mm ±3mm
Inspection Theory 2D + 3D image data analysis 2D + 3D image data analysis
Inspection Speed 330ms / FOV (2D+3D) 330ms / FOV (2D+3D)
Inspection Defects Insufficient paste, excessive paste, bridging, shifting, no paste, shorts, icicles, shape defects
Conveyor System Bottom-up fix board clamping; Automatic loading/unloading; Auto rail width adjustment; SMEMA standard; Rail height: 900 ± 20mm
Power Requirements AC 220V, 50/60Hz, 1.8 KVA AC 220V, 50/60Hz, 1.8 KVA
Air Requirements 0.5 MPa 0.5 MPa
Environment Temp: 5–40℃; Humidity: 25%–80% RH Temp: 5–40℃; Humidity: 25%–80% RH
Interfaces SMEMA SMEMA