Meraif S1 Solder Paste Inspection SPI Machine Distributor

As a distributor, we supply the Meraif S1 Solder Paste Inspector. This advanced SPI machine ensures PCB quality with high-speed 3D inspection, precise measurement of volume, height, and bridging, and AI-powered algorithms for maximum production yield.

Inquiry

Model Variants: S1 (Standard), S1-D (Dual Lane), S1-L (Large Board)

Parameter Specification Details
Board Size Range S1: 50x50mm – 510x460mm
S1-D: 50x50mm – 510x275mm / 510x600mm
S1-L: 50x50mm – 1200x460mm
Thickness Range 0.5mm – 6mm
Component Height Top side: 40mm, Bottom side: 40mm
Process Side 3mm
Camera 5MP color high-speed industrial camera
Light Source RGB+W four-color integral light source + one-direction structured light projection unit
Resolution 15μm @ 36*30mm FOV
Solder Paste Detection Height, excess solder, insufficient solder, offset, bridging, solder balls, shape, coplanarity
Barcode Identification 1D barcode, QR code, character recognition
Mixed Board Test Supported with automatic program calling
Algorithm Deep neural network, image contrast, color contrast, contour recognition
Speed 0.3 seconds per FOV (Field of View)
Key Functions Remote control/assistance, Gerber file import, custom model training
Communication Standard SMEMA interface
Data Output Automated SPC statistical analysis report generation
Computer Industrial control computer
Display 24-inch FHD monitor
Motion System High-precision ball screw + servo motor
Operation Mode Manual and automatic
Power Supply AC220V, 2-2.5KVA (varies by model)
Air Supply 0.4 – 0.6 Mpa
Operating Environment Temperature: 10-45°C, Humidity: 30-85% RH