Complete Turnkey SMT Line Solutions

From concept to full production. Launch your electronics manufacturing with integrated equipment, expert installation, comprehensive training, and ongoing support

End-to-End Implementation Timeline

Five-phase turnkey process from assessment to full production deployment

Phase 1

Assessment & Design

3-5 Days

Production requirements analysis
3D factory layout design
Equipment selection
Utility planning
meraif customer factory

Phase 2

Detailed Quotation

1 Days

Equipment specifications
Installation & commissioning
Training program details
Project timeline
meraif customer factory

Phase 3

Manufacturing & Preparation

10-15 Days

Equipment manufacturing
Quality testing
Documentation prep
Factory acceptance testing
meraif customer factory

Phase 4

Delivery & Installation

10-15 Days

International shipping
Equipment positioning
Electrical connections
Safety systems
meraif customer factory

Phase 5

Commissioning & Training

1-2 Weeks

System debugging
Process optimization
Operator training
Sample production runs
meraif customer factory

Standard Line Configurations

Four proven configurations for different production requirements

Phase 1

Basic Automatic Line

Semi-automatic printer + PCB loader
Single placement machine
Reflow oven + Conveyors
Basic material handling
Ideal For: Small manufacturers, 3,000-8,000 CPH

Phase 2

Quality-Focused Inline

Fully automatic solder paste printer
Inline 3D SPI (solder paste inspection)
Single high-speed pick-and-place machine
Reflow oven + full conveyor set
Ideal For: Stable daily production where first-pass yield matters,8,000–18,000 CPH.

Phase 3

High-Throughput Dual-Mounter Line

Fully automatic printer + inline 3D SPI
Dual pick-and-place setup (chip-shooter + flexible mounter)
Reflow oven + buffering conveyors (line balancing)
Inline AOI (2D/3D options) + PCB unloader
Ideal For: Medium-to-high volume OEM/EMS,18,000–40,000 CPH

Phase 4

Smart Line (High-Mix, High-Reliability)

Fully automatic printer + advanced process control readiness
3D SPI with data feedback for print consistency
Flexible pick-and-place (optimized for frequent changeovers)
Nitrogen-capable reflow oven option (low O₂ process window)
Ideal For: High-mix, fine-pitch, quality-critical products.000 CPH.
Ratings and Testimonials

Advanced In-Line Quality Control & SMT Defect Prevention (SPI + AOI)

Technical highlights
3D SPI before placement: detects insufficient/excess paste, offset, bridging risk; stops defects before they become scrap
AOI placement verification
identifies polarity errors, missing parts, rotation, offset; supports high-mix programs
Post-reflow AOI
confirms solder joint appearance, bridges, tombstoning, solder balling indicators
Inspection recipe engineering
CAD import, library management, false-call reduction strategy (threshold tuning)
Defect containment flow
NG/OK sorting, repair loop definition, audit sampling rules
Best for
EMS, high-mix factories, reliability-driven programs, fine-pitch boards.

High-Speed Precision Placement Engineering

Throughput is not just CPH—it’s stable placement accuracy under real production conditions: replenishment, changeovers, and part variability.
Technical highlights
Placement architecture: multi-nozzle heads, optimized travel path, feeder strategy (chip-heavy vs IC-heavy)
Vision system fundamentals
fiducial alignment, component centering, on-the-fly correction, package-specific optics
Feeder strategy
intelligent feeder monitoring, splice readiness, error-proofing for downtime reduction
Component capability mapping
0201/01005 (if applicable), QFN/BGA handling approach, tall components clearance
Changeover engineering
offline setup carts, feeder grouping, program version control, first-article procedure
Real throughput model
cycle time drivers (board travel, nozzle swaps, vision time, feeder access)

Soldering & Thermal Process Control

Great placement means nothing without a controlled soldering process. We design reflow profiles, atmosphere options, and downstream soldering to match your product reliability targets.

Profile development

preheat/soak/reflow/cooling tuning; thermal mass variation handling

Lead-free process window

peak temp control, TAL (time above liquidus) planning, component temp limits

Nitrogen reflow option

oxidation reduction for improved wetting consistency

Oven configuration guidance

zone count, heating uniformity, cooling capacity, throughput vs stability tradeoff

Mixed-technology support

optional wave/selective soldering planning for THT connectors and high-pin-count parts

Verification

profiler validation, golden profile lock, periodic audit plan
Line Automation, Conveyor Integration & Interface ReadinessA turnkey line must run as one system. We engineer reliable PCB transfer, buffering, and machine handshakes to minimize micro-stops and maximize OEE.
Inline material flow design: loader/unloader, conveyors, buffers, turn units (as needed), NG/OK diverters
Interface standards: SMEMA today; Hermes readiness if the customer requires upgraded board tracking communication
Line balancing: where to buffer, how to remove bottlenecks, takt-time synchronization between printer/P&P/reflow
Safety & uptime: interlocks, E-stop logic, jam recovery design, maintenance access planning
Installation readiness: utilities map (power/air/network), floor plan & access, commissioning checklist
meraif customer factory

MES Traceability, Data Readiness & OEE Optimization

Engineering credibility today includes data: traceability, recipe control, downtime insight, and continuous improvement loops.
Traceability scope
board ID, program version, feeder/slot mapping, inspection results, reflow profile linkage
OEE monitoring: downtime
downtime categorization (feeder, vision, stencil, conveyor), yield loss tracking, Pareto analysis
Data integration
MES/ERP connectivity approach, barcode/RFID points, audit record structure
Process drift control
inspection trend dashboards, rule-based alarms, maintenance triggers